Pull thermal fixes from Daniel Lezcano:
- Fix invalid index array access on int340x_thermal leading to a kernel
panic (Bartosz Szczepanek)
- Fix debug message level to prevent flooding on some platform (Alex
Hung)
- Fix invalid bank access by reverting "thermal: mediatek: fix register
index error" (Enric Balletbo i Serra)
* tag 'thermal-v5.8-rc6' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
Revert "thermal: mediatek: fix register index error"
thermal: int3403_thermal: Downgrade error message
thermal/int340x_thermal: Prevent page fault on .set_mode() op
Starting from commit "thermal/int340x_thermal: Don't require IDSP to
exist", priv->current_uuid_index is initialized to -1. This value may
be passed to int3400_thermal_run_osc() from int3400_thermal_set_mode,
contributing to page fault when accessing int3400_thermal_uuids array
at index -1.
This commit adds a check on uuid value to int3400_thermal_run_osc.
Fixes: 8d485da0dd ("thermal/int340x_thermal: Don't require IDSP to exist")
Signed-off-by: Bartosz Szczepanek <bsz@semihalf.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
[ rzhang: Add Fixes tag ]
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200708134613.131555-1-bsz@semihalf.com
As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h.
"Result is undefined for negative divisors if the dividend variable
type is unsigned and for negative dividends if the divisor variable
type is unsigned."
In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not
checked sign of divisor before using. It makes undefined temperature
value in case the value is negative.
This patch fixes to satisfy DIV_ROUND_CLOSEST description
and fix bug too. Note that the variable name "reg" is not good
because it should be the same type as rcar_gen3_thermal_read().
However, it's better to rename the "reg" in a further patch as
cleanup.
Signed-off-by: Van Do <van.do.xw@renesas.com>
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[shimoda: minor fixes, add Fixes tag]
Fixes: 564e73d283 ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com
The function cpu_power_to_freq is used to find a frequency and set the
cooling device to consume at most the power to be converted. For example,
if the power to be converted is 80mW, and the em table is as follow.
struct em_cap_state table[] = {
/* KHz mW */
{ 1008000, 36, 0 },
{ 1200000, 49, 0 },
{ 1296000, 59, 0 },
{ 1416000, 72, 0 },
{ 1512000, 86, 0 },
};
The target frequency should be 1416000KHz, not 1512000KHz.
Fixes: 349d39dc57 ("thermal: cpu_cooling: merge frequency and power tables")
Cc: <stable@vger.kernel.org> # v4.13+
Signed-off-by: Finley Xiao <finley.xiao@rock-chips.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200619090825.32747-1-finley.xiao@rock-chips.com
After merging tsens-common.c into tsens.c, we can now mark some
functions static so they don't need any prototype declarations. This
fixes the following issue reported by lkp.
>> drivers/thermal/qcom/tsens.c:385:13: warning: no previous prototype for 'tsens_critical_irq_thread' [-Wmissing-prototypes]
385 | irqreturn_t tsens_critical_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:455:13: warning: no previous prototype for 'tsens_irq_thread' [-Wmissing-prototypes]
455 | irqreturn_t tsens_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:523:5: warning: no previous prototype for 'tsens_set_trips' [-Wmissing-prototypes]
523 | int tsens_set_trips(void *_sensor, int low, int high)
| ^~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:560:5: warning: no previous prototype for 'tsens_enable_irq' [-Wmissing-prototypes]
560 | int tsens_enable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:573:6: warning: no previous prototype for 'tsens_disable_irq' [-Wmissing-prototypes]
573 | void tsens_disable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~~
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/6757a26876b29922929abf64b1c11fa3b3033d03.1590579709.git.amit.kucheria@linaro.org
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
The platform vendor may expose an array of OEM-specific values to be used
in determining DPTF policy. These are obtained via the ODVP method, and
then simply exposed in sysfs. In addition, they are updated when a
notification is received or when the DPTF policy is changed by userland.
Conflicts:
drivers/thermal/intel/int340x_thermal/int3400_thermal.c
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-2-matthewgarrett@google.com
tsens-common.c has outlived its usefuless. It was created expecting lots
of custom routines per version of the TSENS IP. We haven't needed those,
there is now only data in the version-specific files.
Merge the code for tsens-common.c into tsens.c. As a result,
- Remove any unnecessary forward declarations in tsens.h.
- Add a Linaro copyright to tsens.c.
- Fixup the Makefile to remove tsens-common.c.
- Where it made sense, fix some 80-column alignments in the
tsens-common.c code being copied over.
There is no functional change with this patch.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e30e2ba6fa5c007983afd4d7d4e0311c0b57917a.1588183879.git.amit.kucheria@linaro.org
The current codebase makes use of the zero-length array language
extension to the C90 standard, but the preferred mechanism to declare
variable-length types such as these ones is a flexible array member[1][2],
introduced in C99:
struct foo {
int stuff;
struct boo array[];
};
By making use of the mechanism above, we will get a compiler warning
in case the flexible array does not occur last in the structure, which
will help us prevent some kind of undefined behavior bugs from being
inadvertently introduced[3] to the codebase from now on.
Also, notice that, dynamic memory allocations won't be affected by
this change:
"Flexible array members have incomplete type, and so the sizeof operator
may not be applied. As a quirk of the original implementation of
zero-length arrays, sizeof evaluates to zero."[1]
sizeof(flexible-array-member) triggers a warning because flexible array
members have incomplete type[1]. There are some instances of code in
which the sizeof operator is being incorrectly/erroneously applied to
zero-length arrays and the result is zero. Such instances may be hiding
some bugs. So, this work (flexible-array member conversions) will also
help to get completely rid of those sorts of issues.
This issue was found with the help of Coccinelle.
[1] https://gcc.gnu.org/onlinedocs/gcc/Zero-Length.html
[2] https://github.com/KSPP/linux/issues/21
[3] commit 7649773293 ("cxgb3/l2t: Fix undefined behaviour")
Signed-off-by: Gustavo A. R. Silva <gustavoars@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507192517.GA16557@embeddedor
Today, there is no user for the cpuidle cooling device. The targetted
platform is ARM and ARM64.
The cpuidle and the cpufreq cooling device are based on the device tree.
As the cpuidle cooling device can have its own configuration depending
on the platform and the available idle states. The DT node description
will give the optional properties to set the cooling device up.
Do no longer rely on the CPU node which is prone to error and will
lead to a confusion in the DT because the cpufreq cooling device is
also using it. Let initialize the cpuidle cooling device with the DT
binding.
This was tested on:
- hikey960
- hikey6220
- rock960
- db845c
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Tested-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
i.MX8 SoCs DTS file needs system control macro definitions, so move them
into dt-binding headfile, then include/linux/firmware/imx/types.h can be
removed and those drivers using it should be changed accordingly.
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
Now that devfreq supports limiting the frequency range of a device
through PM QoS make use of it instead of disabling OPPs that should
not be used.
The switch from disabling OPPs to PM QoS introduces a subtle behavioral
change in case of conflicting requests (min > max): PM QoS gives
precedence to the MIN_FREQUENCY request, while higher OPPs disabled
with dev_pm_opp_disable() would override MIN_FREQUENCY.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200318114548.19916-4-lukasz.luba@arm.com
Pull thermal updates from Daniel Lezcano:
- Convert tsens configuration DT binding to yaml (Rajeshwari)
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller sensor
(Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve the
error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob
Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson
Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R.
Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson
Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy
Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
* tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits)
Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle
thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n
thermal: imx8mm: Fix build warning of incorrect argument type
thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON
thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state
thermal: imx8mm: Add i.MX8MP support
dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP
thermal: qcom: tsens.h: Replace zero-length array with flexible-array member
thermal: imx_sc_thermal: Fix incorrect data type
thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow
thermal: int340x: processor_thermal: Add Tiger Lake support
thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t
dt-bindings: thermal: make cooling-maps property optional
dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'
dt-bindings: thermal: sprd: Remove redundant 'maxItems'
thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove
thermal: qoriq: Sort includes alphabetically
thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups
thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp()
thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv
...
