The temperature output register of the Loongson-2K2000 is defined in the
chip configuration domain, which is different from the Loongson-2K1000,
so it can't be fallbacked.
We need to use two groups of registers to describe it: the first group
is the high and low temperature threshold setting register; the second
group is the temperature output register.
It is true that this fix will cause ABI corruption, but it is necessary
otherwise the Loongson-2K2000 temperature sensor will not work properly.
Fixes: 72684d99a8 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn
Pull more thermal control updates from Rafael Wysocki:
"These update thermal drivers for ARM platforms by adding new hardware
support (r8a779h0, H616 THS), addressing issues (Mediatek LVTS,
Mediatek MT7896, thermal-of) and cleaning up code.
Specifics:
- Fix memory leak in the error path at probe time in the Mediatek
LVTS driver (Christophe Jaillet)
- Fix control buffer enablement regression on Meditek MT7896 (Frank
Wunderlich)
- Drop spaces before TABs in different places: thermal-of, ST drivers
and Makefile (Geert Uytterhoeven)
- Adjust DT binding for NXP as fsl,tmu-range min/maxItems can vary
among several SoC versions (Fabio Estevam)
- Add support for the H616 THS controller on Sun8i platforms (Martin
Botka)
- Don't fail probe due to zone registration failure because there is
no trip points defined in the DT (Mark Brown)
- Support variable TMU array size for new platforms (Peng Fan)
- Adjust the DT binding for thermal-of and make the polling time not
required and assume it is zero when not found in the DT (Konrad
Dybcio)
- Add r8a779h0 support in both the DT and the rcar_gen3 driver (Geert
Uytterhoeven)"
* tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/rcar_gen3: Add support for R-Car V4M
dt-bindings: thermal: rcar-gen3-thermal: Add r8a779h0 support
thermal/of: Assume polling-delay(-passive) 0 when absent
dt-bindings: thermal-zones: Don't require polling-delay(-passive)
thermal/drivers/qoriq: Fix getting tmu range
thermal/drivers/sun8i: Don't fail probe due to zone registration failure
thermal/drivers/sun8i: Add support for H616 THS controller
thermal/drivers/sun8i: Add SRAM register access code
thermal/drivers/sun8i: Extend H6 calibration to support 4 sensors
thermal/drivers/sun8i: Explain unknown H6 register value
dt-bindings: thermal: sun8i: Add H616 THS controller
soc: sunxi: sram: export register 0 for THS on H616
dt-bindings: thermal: qoriq-thermal: Adjust fsl,tmu-range min/maxItems
thermal: Drop spaces before TABs
thermal/drivers/mediatek: Fix control buffer enablement on MT7896
thermal/drivers/mediatek/lvts_thermal: Fix a memory leak in an error handling path
The number of fsl,tmu-range entries vary among the several NXP SoCs.
- lx2160a has two fsl,tmu-range entries (fsl,qoriq-tmu compatible)
- imx8mq has four fsl,tmu-range entries. (fsl,imx8mq-tmu compatible)
- imx93 has seven fsl,tmu-range entries. (fsl,qoriq-tmu compatible)
Change minItems and maxItems accordingly.
This fixes the following schema warning:
imx93-11x11-evk.dtb: tmu@44482000: fsl,tmu-range: 'oneOf' conditional failed, one must be fixed:
[2147483866, 2147483881, 2147483906, 2147483946, 2147484006, 2147484071, 2147484086] is too long
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240104124952.1975160-1-festevam@gmail.com
Convert the da9062 PMIC device tree binding documentation to json-schema.
Document the missing gpio child node for da9062.
While at it, update description with link to product information and
example.
The missing child node with of_compatible defined in MFD_CELL_OF is
causing the below warning message:
da9062-gpio: Failed to locate of_node [id: -1]
So, make all child nodes with of_compatible defined in struct mfd_cell
as required property for da906{1,2} devices.
The "gpio-controller" and "#gpio-cells" properties are defined in the
parent instead of gpio child node as there are existing driver users
based on these parent properties.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20240131102656.3379-7-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
Document the critical-action property to describe the thermal action
the OS should perform after the critical temperature is reached.
The possible values are "shutdown" and "reboot".
The motivation for introducing the critical-action property is that
different systems may need different thermal actions when the critical
temperature is reached.
For example, in a desktop PC, it is desired that a shutdown happens
after the critical temperature is reached.
However, in some embedded cases, such behavior does not suit well,
as the board may be unattended in the field and rebooting may be a
better approach.
The bootloader may also benefit from this new property as it can check
the SoC temperature and in case the temperature is above the critical
point, it can trigger a shutdown or reboot accordingly.
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231129124330.519423-1-festevam@gmail.com
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present for any node.
Add unevaluatedProperties as needed, and then add any missing properties
flagged by the addition.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926164500.101593-1-robh@kernel.org
Amit Kucheria has not been participating in kernel development in any
way or form for quite some time, so it is not useful to list him as a
designated reviewer for the thermal subsystem or as the thermal zone DT
binding maintainer.
Remove him from the THERMAL entry in MAINTAINERS and list Daniel Lezcano
as the new thermal zone DT binding maintainer.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Pull more thermal control updates from Rafael Wysocki:
"These are mostly updates of thermal control drivers for ARM platforms,
new thermal control support for Loongson-2 and a couple of core
cleanups made possible by recent changes merged previously.
Specifics:
- Check if the Tegra BPMP supports the trip points in order to set
the .set_trips callback (Mikko Perttunen)
- Add new Loongson-2 thermal sensor along with the DT bindings (Yinbo
Zhu)
- Use IS_ERR_OR_NULL() helper to replace a double test on the TI
bandgap sensor (Li Zetao)
- Remove redundant platform_set_drvdata() calls, as there are no
corresponding calls to platform_get_drvdata(), from a bunch of
drivers (Andrei Coardos)
- Switch the Mediatek LVTS mode to filtered in order to enable
interrupts (Nícolas F. R. A. Prado)
- Fix Wvoid-pointer-to-enum-cast warning on the Exynos TMU (Krzysztof
Kozlowski)
- Remove redundant dev_err_probe(), because the underlying function
already called it, from the Mediatek sensor (Chen Jiahao)
- Free calibration nvmem after reading it on sun8i (Mark Brown)
- Remove useless comment from the sun8i driver (Yangtao Li)
- Make tsens_xxxx_nvmem static to fix a sparse warning on QCom tsens
(Min-Hua Chen)
- Remove error message at probe deferral on imx8mm (Ahmad Fatoum)
- Fix parameter check in lvts_debugfs_init() with IS_ERR() on
Mediatek LVTS (Minjie Du)
- Fix interrupt routine and configuratoin for Mediatek LVTS (Nícolas
F. R. A. Prado)
- Drop unused .get_trip_type(), .get_trip_temp() and .get_trip_hyst()
thermal zone callbacks from the core and rework the .get_trend()
one to take a trip point pointer as an argument (Rafael Wysocki)"
* tag 'thermal-6.6-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (29 commits)
thermal: core: Rework .get_trend() thermal zone callback
thermal: core: Drop unused .get_trip_*() callbacks
thermal/drivers/tegra-bpmp: Check if BPMP supports trip points
thermal: dt-bindings: add loongson-2 thermal
thermal/drivers/loongson-2: Add thermal management support
thermal/drivers/ti-soc-thermal: Use helper function IS_ERR_OR_NULL()
thermal/drivers/generic-adc: Removed unneeded call to platform_set_drvdata()
thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata()
thermal/drivers/mediatek/auxadc_thermal: Removed call to platform_set_drvdata()
thermal/drivers/sun8i_thermal: Remove unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/brcstb_thermal: Removed unneeded platform_set_drvdata()
thermal/drivers/mediatek/lvts_thermal: Make readings valid in filtered mode
thermal/drivers/k3_bandgap: Remove unneeded call to platform_set_drvdata()
thermal/drivers/k3_j72xx_bandgap: Removed unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/sr-thermal: Removed call to platform_set_drvdata()
thermal/drivers/samsung: Fix Wvoid-pointer-to-enum-cast warning
thermal/drivers/db8500: Remove redundant of_match_ptr()
thermal/drivers/mediatek: Clean up redundant dev_err_probe()
thermal/drivers/sun8i: Free calibration nvmem after reading it
thermal/drivers/sun8i: Remove unneeded comments
...
Pull devicetree updates from Rob Herring:
"DT core:
- Add support for generating DT nodes for PCI devices. This is the
groundwork for applying overlays to PCI devices containing
non-discoverable downstream devices.
- DT unittest additions to check reverted changesets, to test for
refcount issues, and to test unresolved symbols. Also, various
clean-ups of the unittest along the way.
- Refactor node and property manipulation functions to better share
code with old API and changeset API
- Refactor changeset print functions to a common implementation
- Move some platform_device specific functions into of_platform.c
Bindings:
- Treewide fixing of typos
- Treewide clean-up of SPDX tags to use 'OR' consistently
- Last chunk of dropping unnecessary quotes. With that, the check for
unnecessary quotes is enabled in yamllint.
- Convert ftgmac100, zynqmp-genpd, pps-gpio, syna,rmi4, and qcom,ssbi
bindings to DT schema format
- Add Allwinner V3s xHCI USB, Saef SF-TC154B display, QCom SM8450
Inline Crypto Engine, QCom SM6115 UFS, QCom SDM670 PDC interrupt
controller, Arm 2022 Cortex cores, and QCom IPQ9574 Crypto bindings
- Fixes for Rockchip DWC PCI binding
- Ensure all properties are evaluated on USB connector schema
- Fix dt-check-compatible script to find of_device_id instances with
compiler annotations"
* tag 'devicetree-for-6.6' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (64 commits)
dt-bindings: usb: Add V3s compatible string for OHCI
dt-bindings: usb: Add V3s compatible string for EHCI
dt-bindings: display: panel: mipi-dbi-spi: add Saef SF-TC154B
dt-bindings: vendor-prefixes: document Saef Technology
dt-bindings: thermal: lmh: update maintainer address
of: unittest: Fix of_unittest_pci_node() kconfig dependencies
dt-bindings: crypto: ice: Document sm8450 inline crypto engine
dt-bindings: ufs: qcom: Add ICE to sm8450 example
dt-bindings: ufs: qcom: Add sm6115 binding
dt-bindings: ufs: qcom: Add reg-names property for ICE
dt-bindings: yamllint: Enable quoted string check
dt-bindings: Drop remaining unneeded quotes
of: unittest-data: Fix whitespace - angular brackets
of: unittest-data: Fix whitespace - indentation
of: unittest-data: Fix whitespace - blank lines
of: unittest-data: Convert remaining overlay DTS files to sugar syntax
of: overlay: unittest: Add test for unresolved symbol
of: unittest: Add separators to of_unittest_overlay_high_level()
of: unittest: Cleanup partially-applied overlays
of: unittest: Merge of_unittest_apply{,_revert}_overlay_check()
...
Convert the Tegra thermal bindings from the free-form text format to
json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
