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60 Commits

Author SHA1 Message Date
Georgi Djakov
d1c1649113 Merge branch 'icc-sm7150' into icc-next 
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC.

* icc-sm7150
  dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings
  interconnect: qcom: Add SM7150 driver support

Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2024-02-29 22:43:01 +02:00
Danila Tikhonov
9c4058493b dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings 
The Qualcomm SM7150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2024-02-29 22:42:19 +02:00
Georgi Djakov
6025a81ae6 Merge branch 'icc-cleanup' into icc-next 
* icc-cleanup
  interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes
  dt-bindings: interconnect: Remove bogus interconnect nodes
  interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_node
  interconnect: qcom: sm8250: constify pointer to qcom_icc_node
  interconnect: qcom: sm6115: constify pointer to qcom_icc_node
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm
  interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm
  dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address
  interconnect: constify of_phandle_args in xlate

Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2024-02-26 00:42:03 +02:00
Konrad Dybcio
e92c932674 dt-bindings: interconnect: Remove bogus interconnect nodes 
The downstream kernel has infrastructure for passing votes from different
interconnect nodes onto different RPMh RSCs. This neither implemented, not
is going to be implemented upstream (in favor of a different solution
using ICC tags through the same node).

Unfortunately, as it happens, meaningless (in the upstream context) parts
of the vendor driver were copied, ending up causing havoc - since all
"per-RSC" (in quotes because they all point to the main APPS one) BCMs
defined within the driver overwrite the value in RPMh on every
aggregation.

To both avoid keeping bogus code around and possibly introducing
impossible-to-track-down bugs (busses shutting down for no reason), get
rid of the duplicated ICC node definitions.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2024-01-31 15:48:19 +02:00
Adam Skladowski
47878b4512 dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindings 
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.

[Stephan: Drop separate mm-snoc that exists downstream since it's
 actually the same NoC as SNoC in hardware]

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2024-01-31 15:08:46 +02:00
Bjorn Andersson
ea0b1a4c5a Merge branch 'icc-sm6115' of https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD 
Merge the SM6115 interconnect binding to allow referecing the
interconnect header files and the ports defined in these.
 2023-12-16 23:18:16 -06:00
Bjorn Andersson
779266b127 Merge branch 'icc-x1e80100' of https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 
Merge the X1E80100 interconnect binding to get access to the
interconnect port constants.
 2023-12-07 20:24:09 -08:00
Konrad Dybcio
658902913c dt-bindings: interconnect: Add Qualcomm SM6115 NoC 
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-12-06 17:16:07 +02:00
Rajendra Nayak
dc84a76f05 dt-bindings: interconnect: Add Qualcomm X1E80100 SoC 
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled
and tuned dynamically according to the bandwidth demand.

Co-developed-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com>
Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-11-24 00:24:07 +02:00
Neil Armstrong
80abebd9bf dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm SM8650 SoC 
Document the RPMh Network-On-Chip Interconnect of the SM8650 platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-11-24 00:14:52 +02:00
Rohit Agarwal
956329ec7c dt-bindings: interconnect: Add compatibles for SDX75 
Add dt-bindings compatibles and interconnect IDs for
Qualcomm SDX75 platform.

Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/1694614256-24109-2-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-10-10 12:14:51 +03:00
Georgi Djakov
10cb3abb99 Merge branch 'icc-sm8250-qup' into icc-next 
SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't
provide a qup-core path. Adjust the bindings and drivers as necessary,
and then describe the icc paths in the device tree. This makes it possible
for interconnect sync_state succeed so long as you don't use UFS.

* icc-sm8250-qup
  dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt
  dt-bindings: interconnect: qcom,sm8250: Add QUP virt
  interconnect: qcom: sm8250: Fix QUP0 nodes

Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-0-9ba0a9460be2@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-07-18 11:18:53 +03:00
Konrad Dybcio
ddd6c5b9ee dt-bindings: interconnect: qcom,sm8250: Add QUP virt 
Add the required defines for QUP_virt nodes.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-2-9ba0a9460be2@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-07-16 18:15:08 +03:00
Konrad Dybcio
7296bd3f00 dt-bindings: interconnect: Add Qcom RPM ICC bindings 
The SMD RPM interconnect driver requires different icc tags to the
RPMh driver. Add bindings to reflect that.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20230526-topic-smd_icc-v7-1-09c78c175546@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
 2023-07-15 09:54:44 -07:00
Dmitry Baryshkov
375cccc659 dt-bindings: interconnect/msm8996-cbf: add defines to be used by CBF 
On msm8996 CBF interconnects power and performance CPU clusters. Add
corresponding interconnect defines to be used in device trees.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Tested-by: Yassine Oudjana <y.oudjana@protonmail.com>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230512001334.2983048-2-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-05-18 19:02:14 +03:00
Georgi Djakov
b1f5e7ff0c Merge branch 'icc-sa8775p' into icc-next 
* icc-sa8775p
  dt-bindings: interconnect: qcom: document the interconnects for sa8775p
  interconnect: qcom: add a driver for sa8775p
  dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo

Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-02-06 15:39:41 +02:00
Georgi Djakov
b9544fb577 Merge branch 'icc-sdm670' into icc-next 
* icc-sdm670
  dt-bindings: interconnect: add sdm670 interconnects
  interconnect: qcom: add sdm670 interconnects

Link: https://lore.kernel.org/r/20230111005155.50452-1-mailingradian@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-02-06 15:39:15 +02:00
Georgi Djakov
863ed40ea9 Merge branch 'icc-ip0-migration' into icc-next 
Commits 2f3724930e ("interconnect: qcom: sc7180: Drop IP0
interconnects") and 2fb251c265 ("interconnect: qcom: sdx55: Drop IP0
interconnects") removed IP0 interconnects (and ipa-virt devices support)
in favour of the RPMH clocks. Follow this example for other platforms
defining IP0 RPMH resource. While we are at it, remove several leftover
from the mentioned patches.

* icc-ip0-migration:
  interconnect: qcom: sdx55: drop IP0 remnants
  interconnect: qcom: sc7180: drop IP0 remnants
  interconnect: move ignore_list out of of_count_icc_providers()
  interconnect: qcom: sm8150: Drop IP0 interconnects
  interconnect: qcom: sm8250: Drop IP0 interconnects
  interconnect: qcom: sc8180x: Drop IP0 interconnects
  interconnect: qcom: sc8280xp: Drop IP0 interconnects
  dt-bindings: interconnect: qcom: Remove ipa-virt compatibles
  dt-bindings: interconnect: qcom: drop IPA_CORE related defines

Link: https://lore.kernel.org/r/20230109002935.244320-1-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-02-06 15:38:22 +02:00
Bartosz Golaszewski
2579af94c8 dt-bindings: interconnect: qcom: document the interconnects for sa8775p 
Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p
platforms.

Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-01-19 20:22:11 +02:00
Richard Acayan
81ccf45571 dt-bindings: interconnect: add sdm670 interconnects 
There are controllable interconnects on Snapdragon 670. Add the
compatible strings to the documentation and interconnect ID definitions.

The device tree header was generated by
linux-interconnect-driver-generator and the copyright year was changed.

Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230111005155.50452-2-mailingradian@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-01-19 20:12:40 +02:00
Dmitry Baryshkov
e51c94dd9c dt-bindings: interconnect: qcom: drop IPA_CORE related defines 
These interconnects are modeled as clks, not interconnects, therefore
remove corresponding defines from the binding as they're unused.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230109002935.244320-10-dmitry.baryshkov@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-01-18 16:16:19 +02:00
Georgi Djakov
163ea2048d Merge branch 'icc-qdu1000' into icc-next 
Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000
SoCs.

The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit
1000 are new SoCs meant for enabling Open RAN solutions. See more at
https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf

Link: https://lore.kernel.org/r/20221216230914.21771-1-quic_molvera@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-01-05 16:17:08 +02:00
Melody Olvera
991f1372d0 dt-bindings: interconnect: Add QDU1000/QRU1000 devices 
Add separate schema for QDU1000 and QRU1000 interconnect devices
to document the different NoCs on these platforms.

Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20221216230914.21771-2-quic_molvera@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2023-01-05 16:14:07 +02:00
Abel Vesa
66773faf05 dt-bindings: interconnect: Add Qualcomm SM8550 
The Qualcomm SM8550 SoC has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221202232054.2666830-2-abel.vesa@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-12-29 11:36:33 +02:00
Georgi Djakov
33f033dc30 Merge branch 'icc-imx8mp' into icc-next 
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial
value after power up is invalid, need set a valid value after related
power domain up.

This patchset also includes two patch[1,2] during my development to enable
the ICC feature for i.MX8MP.

I not include ddrc DVFS in this patchset, ths patchset is only to
support NoC value mode/priority/ext_control being set to a valid value
that suggested by i.MX Chip Design Team. The value is same as NXP
downstream one inside Arm Trusted Firmware:
https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97

Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-07-15 17:55:48 +03:00
Peng Fan
e2a4a0eeb0 dt-bindings: interconnect: add fsl,imx8mp.h 
Add fsl,imx8mp.h for i.MX8MP

Signed-off-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-07-04 16:14:22 +03:00
Luca Weiss
394fb16954 dt-bindings: interconnect: Add Qualcomm SM6350 NoC support 
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices.

As SM6350 has two pairs of NoCs sharing the same reg, allow this in the
binding documentation, as was done for qcm2290.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-06-20 14:27:03 +03:00
Georgi Djakov
314cf651fa Merge branch 'icc-sc8180x' into icc-next 
This contains a few fixes for the sc8180x interconnect provider driver to make
it functional.

* icc-sc8180x
  dt-bindings: interconnect: Add SC8180X QUP0 virt provider
  interconnect: qcom: sc8180x: Modernize sc8180x probe
  interconnect: qcom: sc8180x: Fix QUP0 nodes
  interconnect: qcom: sc8180x: Mark some BCMs keepalive

Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-05-18 03:02:55 +03:00
Bjorn Andersson
42c4e3f670 interconnect: qcom: sc8180x: Fix QUP0 nodes 
The QUP0 BCM relates to some internal property of the QUPs, and should
be configured independently of the path to the QUP. In line with other
platforms expose QUP_CORE endpoints in order allow this configuration.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-05-18 02:51:34 +03:00
Georgi Djakov
828ff75c44 Merge branch 'icc-sdx65' into icc-next 
This adds interconnect driver support for SDX65 platform for scaling the
bandwidth requirements over RPMh.

Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-05-18 02:40:50 +03:00
Rohit Agarwal
d405ac52ab dt-bindings: interconnect: Add Qualcomm SDX65 DT bindings 
Add interconnect IDs for Qualcomm SDX65 platform.

Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-04-26 14:11:26 +03:00
Bjorn Andersson
ea3364db90 dt-bindings: interconnect: qcom: Add sc8280xp binding 
The Qualcomm SC8280XP platform has the usual set of busses, add a
binding for these interconnect providers and port definitions to allow
interconnect paths to be expressed in the sc8280xp DeviceTree.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2022-04-22 11:04:34 +03:00
Georgi Djakov
01f8938ad0 Merge branch 'icc-qcm2290' into icc-next 
Add support for QCM2290 including a few prep changes.

* icc-qcm2290
  interconnect: icc-rpm: Define ICC device type
  interconnect: icc-rpm: Add QNOC type QoS support
  interconnect: icc-rpm: Support child NoC device probe
  dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support
  interconnect: qcom: Add QCM2290 driver support

Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-12-15 07:14:27 +02:00
Shawn Guo
061dbde2bf dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support 
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-12-15 07:13:08 +02:00
Georgi Djakov
4a5cf65d00 Merge branch 'icc-sm8450' into icc-next 
This add device tree binding and driver for interconnect providers found in
SM8450 SoC.

* icc-sm8450
  dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings
  interconnect: qcom: Add SM8450 interconnect provider driver

Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-12-14 23:44:01 +02:00
Vinod Koul
0ae8c62528 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings 
The Qualcomm SM8450 SoC has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand

Signed-off-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-12-14 23:42:47 +02:00
Yassine Oudjana
3e9fdc6b73 dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindings 
Add bindings for interconnects on Qualcomm MSM8996.

Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c
Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-11-22 18:25:56 +02:00
Georgi Djakov
d81274f8fd dt-bindings: interconnect: Add Qualcomm SC8180x DT bindings 
Add compatibles and port definitions for the SC8180x RPMH interconnect
providers.

Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
[bjorn: Split defines from driver patch and added binding update]
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-08-09 15:16:31 +03:00
Odelu Kukatla
0b88961893 dt-bindings: interconnect: Add Qualcomm SC7280 DT bindings 
The Qualcomm SC7280 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
 2021-05-11 11:52:59 +03:00
Georgi Djakov
c1de07884f Merge branch 'icc-sm8350' into icc-next 
This adds interconnect support for SM8350 SoC.

* icc-sm8350
  dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings
  interconnect: qcom: Add SM8350 interconnect provider driver
  interconnect: qcom: sm8350: Use the correct ids
  interconnect: qcom: sm8350: Add missing link between nodes

Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-04-02 13:12:37 +03:00
Vinod Koul
c009ffe661 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings 
The Qualcomm SM8350 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-03-27 14:33:37 +02:00
AngeloGioacchino Del Regno
33ad280034 dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC 
Add the bindings for the Qualcomm SDM660-class NoC, valid for
SDM630, SDM636, SDM660 and SDA variants.

Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-03-08 15:09:45 +02:00
Georgi Djakov
6715ea06ce Merge branch 'icc-sdx55' into icc-next 
Add interconnect driver support for SDX55 platform for scaling the
bandwidth requirements over RPMh.

* icc-sdx55
  dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings
  interconnect: qcom: Add SDX55 interconnect provider driver

Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-02-01 14:26:57 +02:00
Manivannan Sadhasivam
acda36189c dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings 
The Qualcomm SDX55 platform has several bus fabrics that could be
controlled and tuned dynamically over RPMh according to the bandwidth
demand.

Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-01-27 13:11:33 +02:00
Jun Nie
4ec908d210 dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindings 
The Qualcomm MSM8939 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jun Nie <jun.nie@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2021-01-05 13:10:38 +02:00
Georgi Djakov
8742bb4bf2 dt-bindings: interconnect: sdm845: Add IDs for the QUP ports 
The QUP ports exist in the topology, but are not exposed as an
endpoints in DT. Fix this by creating IDs and attach them to their
NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able
to request their interconnect paths and scale their bandwidth.

Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
 2020-11-30 10:42:47 -06:00
Sibi Sankar
c4877059e0 dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250 
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250
SoCs.

Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2020-09-08 16:29:01 +03:00
Mike Tipton
65e0e4d679 dt-bindings: interconnect: Add generic qcom bindings 
Add generic qcom interconnect bindings that are common across platforms. In
particular, these include QCOM_ICC_TAG_* macros that clients can use when
calling icc_set_tag().

Signed-off-by: Mike Tipton <mdtipton@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2020-09-08 16:28:54 +03:00
Jonathan Marek
cb6ffd717c dt-bindings: interconnect: Add Qualcomm SM8250 DT bindings 
The Qualcomm SM8250 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jonathan Marek <jonathan@marek.ca>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2020-09-08 16:28:50 +03:00
Jonathan Marek
3fe3578c8a dt-bindings: interconnect: Add Qualcomm SM8150 DT bindings 
The Qualcomm SM8150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jonathan Marek <jonathan@marek.ca>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
 2020-09-08 16:28:49 +03:00