The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-22-daniel.lezcano@linexp.org
Reviewed-by: Bryan Brattlof <bb@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
